Electrical circuit board and a method for making the same
The present invention relates to a method for making an electrical circuit board and more particularly, to a method for making a multi-layer electrical circuit board having interconnections between portions or layers of the circuit board. A method for forming connections within a multi-layer electro...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a method for making an electrical circuit board and more particularly, to a method for making a multi-layer electrical circuit board having interconnections between portions or layers of the circuit board.
A method for forming connections within a multi-layer electronic circuit board . In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board |
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