Integrated circuit package incorporating camouflaged programmable elements
The invention relates to integrated circuits, and more particularly, to the prevention of tampering with the operating parameters for integrated circuitry. An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to integrated circuits, and more particularly, to the prevention of tampering with the operating parameters for integrated circuitry.
An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated by a programmable link. The programmable element is positioned on a surface other than the top surface, e.g., a side surface or the bottom surface of the package substrate to render them less conspicuous to unscrupulous suppliers intent on tampering with the package. The information programmed by the fuses may relate to speed or voltage ratings for a microprocessor. |
---|