Solder mask for controlling resin bleed

The present invention relates generally to semiconductor packaging technology. The present invention has particular applicability to semiconductor packaging comprising a semiconductor chip attached to a substrate with an adhesive resin and electrically connected to bond fingers on the substrate. Damage to and short circuiting of bond fingers on a substrate due to die-attach resin bleed is prevented, thereby increasing yield and improving reliability. Embodiments include forming a trough in a solder mask on a substrate between the bond fingers and semiconductor chip to prevent the die-attach resin from reaching the bond fingers.