Heat treating method for thin film and forming method for thin film

The present invention relates to a heat treatment method for heat treating and depositing a thin film used for a gate electrode and wiring of a semi-conductor device. A heat treatment method for heat treating a thin film is a method for heat treating the thin film having a metallic silicide layer, c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Suzuki, Kenji, Matsudo, Masahiko
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to a heat treatment method for heat treating and depositing a thin film used for a gate electrode and wiring of a semi-conductor device. A heat treatment method for heat treating a thin film is a method for heat treating the thin film having a metallic silicide layer, comprising a heating step, a temperature keeping step and a cooling step. Among these steps, the thin film is heated in an atmosphere of gas which is oxidizing gas or includes oxidizing gas at least in the heating step. An oxide film is formed on the thin film in the heating step to prevent the phosphorous atoms from escaping.