Brake pressure modulator with pressure sensor manifold

This invention relates to a brake pressure modulator having a pressure sensing manifold for sensing master cylinder braking pressure. Master cylinder pressure of either or both of the primary and secondary braking circuits is sensed by a pressure sensor or sensors mounted in a manifold which is installed directly on a brake pressure modulator housing when the modulator is manufactured. The pressure sensors receive power and are grounded through the electronic control unit which is an integral component of the modulator; accordingly, the sensors do not require external electrical connections other than those already provided on the modulator. Since the sensing manifold is installed and tested for leaks when the modulator is manufactured and before the modulator is shipped to the vehicle assembly plant, assembly operations in addition to those required in installation of the modulator in the vehicle braking system are not required.