Eddy current limiting thermal plate
1. Field of the Invention The present invention is a method and apparatus to limit eddy current in a thermal plate. A plate is coupled to a die of an integrated circuit for thermal dissipation. The plate has first and second pluralities of grooves comprising non-periodic lines in first and second di...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | 1. Field of the Invention
The present invention is a method and apparatus to limit eddy current in a thermal plate. A plate is coupled to a die of an integrated circuit for thermal dissipation. The plate has first and second pluralities of grooves comprising non-periodic lines in first and second directions, respectively. The first and second pluralities of grooves form a grid pattern. |
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