Microfabricated structures with trench-isolation using bonded-substrates and cavities

1. Field of the Invention A microstructure and method for forming the microstructure are disclosed. The method includes: providing a handle substrate; providing a device substrate in which high-aspect-ratio structures and optional integrated circuitry will be fabricated; forming one or more filled i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Clark, William A, Lemkin, Mark A, Juneau, Thor N, Roessig, Allen W
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!