Method for connecting an electrical device to a circuit substrate

1. Field of the Invention A method of making a circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g., copper, thereon separated by a suitable dielectric material, e.g., polyimide. Each layer includes its own conduct...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lewis, Robert Lee, Sebesta, Robert David, Waits, Daniel Martin
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:1. Field of the Invention A method of making a circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g., copper, thereon separated by a suitable dielectric material, e.g., polyimide. Each layer includes its own conductive location(s) which are designed for being directly electrically connected, e.g. using solder, to respective contact sites on a semiconductor chip to form part of the final package. Significantly, the resulting package does not include interconnections between the conductive layers at the desired contact locations; these locations, as mentioned, instead being directly connected to the chip.