System and method for forming stable solder bonds
The present invention relates to the field of soldering, in particular to forming stable solder bonds between conductive pads. A solder bonding system that includes a substrate having a recess and a conductive pad having a width. The conductive pad is disposed in the recess of the substrate. The sol...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to the field of soldering, in particular to forming stable solder bonds between conductive pads.
A solder bonding system that includes a substrate having a recess and a conductive pad having a width. The conductive pad is disposed in the recess of the substrate. The solder bonding system also includes a solder pad contacting the conductive pad. The solder pad has a width greater than the width of the conductive pad. When the solder pad is heated, it forms a stable solder bond between the conductive pads. |
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