Electronic device with an enhanced attachment to surface mount lamps
The present invention relates generally to electronic devices having surface mount lamps, and more particularly concerns circuit boards of the electronic devices using adhesive pads to secure the surface mount lamps to the circuit boards in automated assembly processing. An electronic device having...
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Sprache: | eng |
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Zusammenfassung: | The present invention relates generally to electronic devices having surface mount lamps, and more particularly concerns circuit boards of the electronic devices using adhesive pads to secure the surface mount lamps to the circuit boards in automated assembly processing.
An electronic device having an enhanced attachment to a surface mount lamp () includes a circuit board (), at least two conductive pads (), at least two adhesive pads (), and the surface mount lamp (). The conductive pads () and the adhesive pads () are integrally formed within the circuit board (). Preferably, each section of the circuit board () allotted for one surface mount lamp () has two conductive pads () and two adhesive pads arranged in a grid-like pattern such that similar pads are in opposing corners of the grid. The surface mount lamp () has two electrical leads (), each protruding from opposing corners of a base () of the surface mount lamp (). These electrical leads () are soldered to the conductive pads () in the circuit board (). The unobscured opposing corners () of the plastic base () are partially melted and adhered to the adhesive pads () in the circuit board (). |
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