Printed circuit board (PCB)

The present invention relates to printed circuit boards (PCBs) and, more particularly, to a PCB having slots formed at a center pad thereof to prevent formation of voids and residues at solder joint areas and to improve RF grounding characteristics of the PCB. A printed circuit board (PCB) is provided for mounting an electronic package thereon. The PCB includes a center pad centrally located in the PCB, a plurality of input/output (I/O) pins peripherally located in the PCB, and at least one slot formed in the center pad for providing escape areas into which contaminants can escape from solder joints associated with mounting of the electronic package onto the PCB.