Method and structure for retarding high temperature agglomeration of silicides using alloys

The present invention relates to complementary metal oxide semiconductor (CMOS) devices, and more particular to a method of fabricating CMOS devices having at least one metal silicide contact in which high temperature agglomeration of the same, typically caused during source/drain activation, is substantially eliminated. The present invention also provides CMOS structures having non-agglomerated metal silicide contacts prepared by the inventive process. Complementary metal oxide semiconductor (CMOS) devices having metal silicide contacts that withstand the high temperature anneals used in activating the source/drain regions of the devices are provided by adding at least one alloying element to an initial metal layer used in forming the silicide.