Enhanced mounting pads for printed circuit boards

1. Field of the Invention There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate having at least one mounting pad thereon, wherein each mounting pad is a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Brunner, Bjoern Erik, Jairazbhoy, Vivek Amir, McMillan, Richard Keith
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!