Enhanced mounting pads for printed circuit boards
1. Field of the Invention There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate having at least one mounting pad thereon, wherein each mounting pad is a...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | 1. Field of the Invention
There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate having at least one mounting pad thereon, wherein each mounting pad is arranged in matched relation with a respective termination of an electronic component . Each mounting pad includes a main body portion and one or more fingerlike extensions extending outward from the main body portion and away from a projected footprint of the electronic component. |
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