Electronic equipment housing

The present invention relates to an electronic equipment housing usable for various types of electronic equipment such as notebook-type personal computers, portable information instruments, portable acoustic instruments, and on-vehicle electric materials. The present invention relates to an electronic equipment housing usable for various types of electronic equipment such as note-type personal computers, portable information instruments, portable acoustic instruments, and on-vehicle electric materials.The electronic equipment housing of the present invention is formed by bonding two or more plate-like members. These plate-like members are different in thickness from one another. These plate-like members are bonded together through an adhesive.The electronic equipment housing of the present invention can efficiently radiate heat from heating parts, can prevent air bubbles from occurring in an adhesive between plate-like members, can reduce time required to produce the electronic equipment housing and can properly control the heat conduction.