Heat dissipating apparatus and method for electronic components

The present invention relates generally to dissipating heat which is generated by electronic components, and more particularly to an apparatus and method for cooling electronic components with the use of a fluid. A method and apparatus dissipates heat generated by an electronic device. The apparatus...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Caldwell, Barry E
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!