Heat dissipating apparatus and method for electronic components
The present invention relates generally to dissipating heat which is generated by electronic components, and more particularly to an apparatus and method for cooling electronic components with the use of a fluid. A method and apparatus dissipates heat generated by an electronic device. The apparatus...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!