Heat dissipating apparatus and method for electronic components

The present invention relates generally to dissipating heat which is generated by electronic components, and more particularly to an apparatus and method for cooling electronic components with the use of a fluid. A method and apparatus dissipates heat generated by an electronic device. The apparatus includes a channel structure that is in thermal communication with heat generated by the electronic device. The apparatus further includes a pump array operative to advance fluid within the channel structure. In addition, the apparatus includes a baffle array positionable in relation to the channel structure in a first group position and a second group position, wherein fluid advancing within the channel structure is diverted to flow (i) in a first flow path defined in the channel structure when the baffle array is positioned in the first group position, and (ii) in a second flow path defined in the channel structure when the baffle array is positioned in the second group position.