Header, a method of manufacture thereof and an electronic device employing the same

The present invention is directed, in general, to electronic devices and, more specifically, to a header containing a semiconductor die, method of manufacture thereof and electronic device employing the same. A header containing a semiconductor die, method of manufacture thereof and electronic device employing the same. In one embodiment, the header includes first and second contacts, and an intermediate body. The intermediate body includes an insulated section interposed between the first and second contacts and has a cavity therein. The intermediate body also includes a semiconductor die, located within the cavity, adapted to condition a signal passing through at least a portion of the header.