Process for resist clean up of metal structures on polyimide

The present invention generally relates to fabrication of metallic structures on a substrate and, more particularly, to a process for removing a resist film containing chlorine residue without affecting an underlying organic structure. A process for removing a resist material containing a chlorine residue from an organic substrate. The process first removes the chlorine residue from the resist material by exposing the resist material to an abbreviated plasma which also removes a portion of the resist material. The remainder of the resist material is removed by exposing the resist material to a solvent which does not affect the organic substrate.