Arrangement for the testing of semiconductor structures

The invention relates to an apparatus for testing semiconductor structures, which is provided with a chuck for holding a semiconductor wafer which has a substantially unstructured underside and an upper side with structure of chips that are to be tested. The apparatus is provided with several needle holders, for externally holding contact needles which are placed on contact islands of the chips to be tested. Moreover, the chuck is provided with contacting means for the semiconductor wafer and is moved relative to the contact needles by a positioning device. The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.