Method of manufacturing semiconductor components
This invention relates, in general, to semiconductor components, and more particularly, to methods of manufacturing semiconductor components. A method of manufacturing semiconductor components () includes assembling, packaging, and testing the semiconductor components () while the semiconductor comp...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | This invention relates, in general, to semiconductor components, and more particularly, to methods of manufacturing semiconductor components.
A method of manufacturing semiconductor components () includes assembling, packaging, and testing the semiconductor components () while the semiconductor components () are mounted on an adhesive layer (). The method of can also keep the semiconductor components () mounted on the adhesive layer () between each of the assembling, packaging, and testing steps. |
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