Circuit board, a method for manufacturing same, and a method of electroless plating

The present invention relates to a novel circuit board, whereon semiconductors and the like are mounted, and a method of manufacturing the same; and more particularly, the invention relates to a circuit board having via-holes filled with metal for connecting interlayer conductor wiring, and a method...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Itabashi, Takeyuki
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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