RF assembly with ground-plane slot between components and method therefor

The present invention relates to the field of RF assembly components. More specifically, the present invention relates to ground-plane interfaces between RF assembly components. An RF assembly () operating at a predetermined wavelength of and having a ground-plane interface () between first and seco...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Seely, Warren Leroy, Fuller, Ronald Dee, Kielmeyer, Jr., Ronald Frank
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to the field of RF assembly components. More specifically, the present invention relates to ground-plane interfaces between RF assembly components. An RF assembly () operating at a predetermined wavelength of and having a ground-plane interface () between first and second components () is presented. A bond wire () couples the components () along a bond-wire directrix (). The components () have grounding members () establishing substantially coplanar ground planes (). The grounding members () are coupled together so as to create a semi-cylindrical slot () having an opening () substantially coincident with the ground planes (). The slot has an axis () proximate the bond-wire directrix (), and a radius () substantially equal to /2. The slot axis () and the bond-wire directrix () are located within a plane () substantially perpendicular to the ground planes ().