Power semiconductor module with terminals having holes for better adhesion

1. Field of the Invention A power semiconductor module, a metal terminal for the power semiconductor module, and methods of fabricating a power semiconductor module and the metal terminal are disclosed. In the power semiconductor module, the metal terminal improves the adhesive strength between the metal terminal and a substrate of the module by increasing the surface area of the metal terminal that contacts an adhesive. A hole and a protrusion formed in an attachment plate of the terminal provide more surface area contacting the adhesive, thereby increasing the adhesive strength between the metal terminal and a metal substrate.