Design of IC package test handler with temperature controller for minimized maintenance

The present invention relates generally to test systems for IC (integrated circuit) packages, and more particularly, to a low maintenance design of an IC package test handler having a chilled water jacket for controlling the temperature at the IC package. An IC package test handler is designed for minimized maintenance. The IC package test handler includes a test handler housing comprised of a thermal insulating material for carrying a chilled water jacket. A test handler base cartridge that is replaceable is mounted to a bottom of the test handler housing and contacts an IC package when the IC package test handler is holding the IC package to a socket of an IC package test station. The test handler base cartridge is comprised of a thermally conductive material and includes a heating element and a temperature sensor embedded therein. A cylinder piston is disposed on top of the chilled water jacket. A temperature controller decreases an amount of compressed air provided to the cylinder piston to retract the cylinder piston away from the chilled water jacket such that the chilled water jacket does not contact the test handler base cartridge, and controls the heating element to heat up the test handler base cartridge, to increase the temperature of the IC package when the temperature at the IC package as sensed by the temperature sensor is below a desired temperature. Alternatively, the temperature controller increases an amount of compressed air provided to the cylinder piston to extend the cylinder piston toward the chilled water jacket such that the chilled water jacket contacts the test handler base cartridge, and controls the heating element to turn off, to decrease the temperature of the IC package when the temperature at the IC package as sensed by the temperature sensor is above the desired temperature.