Method of making an upper housing for a bussed electrical center

The present invention relates generally to an environmentally protected bussed electrical center, and further to a method of fabricating same. An environmentally protected (sealed) BEC () at the upper and lower housing seams () and at each of the connector receptacle (). A lower housing () of the BEC is formed conventionally, as for example by plastic injection molding and may carry a printed circuit board (PCB) (), a spacer plate () and an electrical assemblage () including upstanding blade terminals (). An upper housing () of the BEC is formed in two shots. Firstly, an upper housing body () is formed by a plastic injection molding process using a first upper mold member () mated to a lower mold member (). Next, the first upper mold member is removed, and a second upper mold member () is mated to the lower mold member. A liquid injection molding process now injects a resilient seal (silicone) over all mating surfaces of the upper housing body, including the upper housing seam () and each connector receptacle.