Apparatus for cooling heat generating devices

The disclosures herein relate generally to apparatus for cooling heat generating devices. More particularly, the disclosures herein relate to apparatus for cooling heat generating devices in computers. A computer system including a chassis having a printed circuit substrate mounted thereon. A plurality of microprocessors are mounted on the printed circuit substrate. A first one of the microprocessors is mounted in an in-line configuration with respect to a second one of the microprocessors. A heat dissipating device is mounted on each one of the microprocessors. The heat dissipating device mounted on the first one of the microprocessors includes a first heat dissipating body positioned at a first elevation above a mounting surface of the printed circuit substrate. The heat dissipating device mounted on the second one of the microprocessors includes a second heat dissipating body positioned at a second elevation above the mounting surface of the printed circuit substrate. A fan is mounted on the chassis adjacent to the printed circuit substrate for directing a stream of air over at least a portion of the first and the second heat dissipating bodies. Each heat dissipating body is subjected to a substantially unheated stream of air, improving cooling efficiency.