Method of forming bumps on wafers or substrates

Method of forming bumps on wafers or substrates

1. Field of the Invention A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Shieh, Wen Lo, Huang, Fu Yu, Chuang, Yung-Cheng, Chang, Hsuan Jui, Chen, Hui-Pin, Huang, Ning, Tu, Feng-Chang, Chang, Chung-Ming, Chiang, Hua Wen, Hu, Chia-Chieh
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:1. Field of the Invention A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.