Offset array adapter

The present invention relates to electrical adapters. More particularly, the present invention pertains to electrical adapters for use with packaged devices, e.g., adapters for ball grid array packages. The present invention provides a small adapter apparatus useable for high density integrated circuit packages, e.g., ball grid array packages. The adapter apparatus includes an adapter body member having a length along an adapter axis between a first adapter end and a second adapter end of the adapter body member. An array of contact elements, e.g., solder spheres, are disposed on the first adapter end of the adapter body member. Further, the adapter apparatus includes an array of elongated pin elements. Each elongated pin element corresponds to one of the array of contact elements and extends parallel to the adapter axis from a corresponding contact element through the adapter body member and the second adapter end thereof. One or more of the elongated pin elements of the array is of a different length than one or more other elongated pin elements. Various socket devices for receiving and retaining the elongated pins are also provided. For example, a female to male socket device and a female to female socket device are described which utilize offset conductive retaining portions to receive the elongated pin elements of varying length.