Power distribution printed circuit board for a semiconductor processing system
This invention relates generally to a semiconductor processing system and, more specifically, to a semiconductor processing system having a processing chamber and a heat source assembly. A semiconductor processing system including a printed circuit board structure for delivering power to an assembly...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | This invention relates generally to a semiconductor processing system and, more specifically, to a semiconductor processing system having a processing chamber and a heat source assembly.
A semiconductor processing system including a printed circuit board structure for delivering power to an assembly of radiant energy sources. The printed circuit board structure, in one configuration, forms an evacuable housing for the assembly of radiant energy sources. |
|---|