Semiconductor structure having low resistance and method of manufacturing same

Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming such devices. Between forming a polysilicon layer and a metal layer, an interface reaction preventing layer is created. This reaction preventing layer prevents a...

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Bibliographische Detailangaben
Hauptverfasser: Heo, Seong-Jun, Youn, Sunpil, Kim, Sung-Man, Lee, Chang-Won, Ku, Ja-Hum, Choi, Siyoung
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming such devices. Between forming a polysilicon layer and a metal layer, an interface reaction preventing layer is created. This reaction preventing layer prevents a buildup of highly resistive materials that would otherwise occur when creating conventional semiconductor devices, as well as having other functions.