Method for forming a wafer for use in an optical part and an optical part incorporating such a wafer
An improved method is disclosed, for forming a wafer into a complex, curved shape, for use in an optical part. The method includes a step of moving the wafer into contact with a molding surface having a predetermined non-cylindrical, aspheric curved shape, to form the wafer into a corresponding shap...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An improved method is disclosed, for forming a wafer into a complex, curved shape, for use in an optical part. The method includes a step of moving the wafer into contact with a molding surface having a predetermined non-cylindrical, aspheric curved shape, to form the wafer into a corresponding shape. The step of moving is sufficient, by itself, to form the wafer into the desired non-cylindrical, aspheric curved shape, without the need for additional forming steps. |
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