Lift-off process for protein chip

A protein chip and the preparation thereof. The preparation includes providing a substrate with a positive photoresist thereon, forming a spot array valley in the positive photoresist using a spot pattern mask, forming an adhesive layer on the substrate and filling the spot array valley thereon, per...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tsao, Jia-Huey, Yin, Li-Te, Pan, Chung-We, Chow, Zu-Sho, Tsao, Chao-Yun
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A protein chip and the preparation thereof. The preparation includes providing a substrate with a positive photoresist thereon, forming a spot array valley in the positive photoresist using a spot pattern mask, forming an adhesive layer on the substrate and filling the spot array valley thereon, performing a full region exposure on the positive photoresist and removing the same, thereby leaving the adhesive layer as a spot array pattern on the substrate, and forming an immobilizing material cover the surface of the spot array pattern to obtain a 3-dimensional structure of the immobilizing material.