Methods for processing micro-feature workpieces, patterned structures on micro-feature workpieces, and integrated tools for processing micro-feature workpieces

Method and apparatus for processing a micro-feature workpiece having a workpiece having a first side, a second side, a plurality of micro-devices including submicron features integrated in and/or on the workpiece, and a deep depression or other large three-dimensional feature in either the first side and/or the second side. The method can include forming a thin conductive seed layer on the workpiece that conforms to the depression, and depositing a negative resist layer onto the seed layer. The negative resist layer, for example, can be a highly conformal and uniform layer of negative electrophoretic resist that is deposited onto the seed layer by contacting the seed layer with a bath of negative electrophoretic resist and establishing an electrical field between the seed layer and an electrode in the bath. After depositing the negative resist layer, the method includes removing a portion of the negative resist layer to uncover a deposition area of the seed layer within the depression. The method then includes the additive technique of electrochemically depositing a material onto the deposition area of the seed layer within the depression without covering the entire workpiece with the material.