CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE
Circuit boards ( 1100, 1400 ) and methods for fabricating circuit boards that include conduits ( 1004 ) are provided. The conduits formed by patterning a metal layer ( 1102 ) are lined by inert coating ( 1106 ) and caped by a photodefinable polymer layer ( 1110 ) that is affixed to the inert coating...
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| Format: | Patent |
| Sprache: | eng |
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