CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE
Circuit boards ( 1100, 1400 ) and methods for fabricating circuit boards that include conduits ( 1004 ) are provided. The conduits formed by patterning a metal layer ( 1102 ) are lined by inert coating ( 1106 ) and caped by a photodefinable polymer layer ( 1110 ) that is affixed to the inert coating...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Circuit boards (
1100, 1400
) and methods for fabricating circuit boards that include conduits (
1004
) are provided. The conduits formed by patterning a metal layer (
1102
) are lined by inert coating (
1106
) and caped by a photodefinable polymer layer (
1110
) that is affixed to the inert coating by with the help of an initially uncured polymer layer (
1106
). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit. |
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