CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE
Circuit boards ( 1100, 1400 ) and methods for fabricating circuit boards that include conduits ( 1004 ) are provided. The conduits formed by patterning a metal layer ( 1102 ) are lined by inert coating ( 1106 ) and caped by a photodefinable polymer layer ( 1110 ) that is affixed to the inert coating...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Gamboa, Claudia Eliacin, Manes Lian, Keryn |
| description | Circuit boards (
1100, 1400
) and methods for fabricating circuit boards that include conduits (
1004
) are provided. The conduits formed by patterning a metal layer (
1102
) are lined by inert coating (
1106
) and caped by a photodefinable polymer layer (
1110
) that is affixed to the inert coating by with the help of an initially uncured polymer layer (
1106
). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit. |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20040170410</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20040170410</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200401704103</originalsourceid><addsrcrecordid>eNrjZLBz9vdzCfUMCVbw9AtxdQ9yDHF1ATIVnD2DnIHCCk7-jkEuCo5-Lgq-riEe_i4K_m4Kvo5-oW6OziGhQa48DKxpiTnFqbxQmptB0801xNlDt7S4ILEkNa-kOD6xoCAnMzmxJDM_rzjeyMDAxMDQ3MDE0MCYFLUAgSgw4Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE</title><source>USPTO Published Applications</source><creator>Gamboa, Claudia ; Eliacin, Manes ; Lian, Keryn</creator><creatorcontrib>Gamboa, Claudia ; Eliacin, Manes ; Lian, Keryn</creatorcontrib><description>Circuit boards (
1100, 1400
) and methods for fabricating circuit boards that include conduits (
1004
) are provided. The conduits formed by patterning a metal layer (
1102
) are lined by inert coating (
1106
) and caped by a photodefinable polymer layer (
1110
) that is affixed to the inert coating by with the help of an initially uncured polymer layer (
1106
). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040170410$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10376577$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gamboa, Claudia</creatorcontrib><creatorcontrib>Eliacin, Manes</creatorcontrib><creatorcontrib>Lian, Keryn</creatorcontrib><title>CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE</title><description>Circuit boards (
1100, 1400
) and methods for fabricating circuit boards that include conduits (
1004
) are provided. The conduits formed by patterning a metal layer (
1102
) are lined by inert coating (
1106
) and caped by a photodefinable polymer layer (
1110
) that is affixed to the inert coating by with the help of an initially uncured polymer layer (
1106
). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZLBz9vdzCfUMCVbw9AtxdQ9yDHF1ATIVnD2DnIHCCk7-jkEuCo5-Lgq-riEe_i4K_m4Kvo5-oW6OziGhQa48DKxpiTnFqbxQmptB0801xNlDt7S4ILEkNa-kOD6xoCAnMzmxJDM_rzjeyMDAxMDQ3MDE0MCYFLUAgSgw4Q</recordid><startdate>20040902</startdate><enddate>20040902</enddate><creator>Gamboa, Claudia</creator><creator>Eliacin, Manes</creator><creator>Lian, Keryn</creator><scope>EFI</scope></search><sort><creationdate>20040902</creationdate><title>CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE</title><author>Gamboa, Claudia ; Eliacin, Manes ; Lian, Keryn</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200401704103</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Gamboa, Claudia</creatorcontrib><creatorcontrib>Eliacin, Manes</creatorcontrib><creatorcontrib>Lian, Keryn</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gamboa, Claudia</au><au>Eliacin, Manes</au><au>Lian, Keryn</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE</title><date>2004-09-02</date><risdate>2004</risdate><abstract>Circuit boards (
1100, 1400
) and methods for fabricating circuit boards that include conduits (
1004
) are provided. The conduits formed by patterning a metal layer (
1102
) are lined by inert coating (
1106
) and caped by a photodefinable polymer layer (
1110
) that is affixed to the inert coating by with the help of an initially uncured polymer layer (
1106
). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_uspatents_applications_20040170410 |
| source | USPTO Published Applications |
| title | CONDUITS INTEGRATED IN CIRCUIT BOARD AND METHOD OF MANUFACTURE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T00%3A09%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFI&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Gamboa,%20Claudia&rft.date=2004-09-02&rft_id=info:doi/&rft_dat=%3Cuspatents_EFI%3E20040170410%3C/uspatents_EFI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |