Dual curing silicone compositions

The present invention relates to dual curing silicone compositions which are capable of crosslinking when subjected to actinic radiation and/or heat. The compositions contain a reactive organopolysiloxane having a function group selected from the group consisting of (meth)acrylate, carboxylate, maleate, cinnamate and combinations thereof; a silicon hydride crosslinker; an organo-metallic hydrosilation catalyst; and a photoinitiator. These compositions can be cured to relatively thick films using UV light due to the presence of the specific olefinic unsaturated groups, and can also be partially or fully cured at room temperature or under thermal exposure. These compositions are particularly useful as conformal coatings, and in particular as coatings in electronic applications.