Copper-nickel-silicon two phase quench substrate

A copper- nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstruct...

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Bibliographische Detailangaben
Hauptverfasser: Bye, Richard, Myojin, Shinya, Decristofaro, Nicholas, Lin, Jeng, Millure, David, Cox, Joseph, Walls, Dale, Schuster, Gary
Format: Patent
Sprache:eng
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Zusammenfassung:A copper- nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a finction of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.