System and method for mounting electronic components onto flexible substrates
A system and method for reflowing solder to interconnect a plurality of electronic components ( 24 ) to a substrate ( 12 ) is disclosed. The system includes an oven for preheating the substrate ( 12 ) and the plurality of electronic components ( 24 ) disposed thereon, a supplemental heat source disp...
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| creator | Schweitzer, Charles Goenka, Lakhi Bullock, Lawrence Miller, Mark Baker, Jay Chiles, Karen Achari, Achyuta Bullock, Jason Bullock, Shona |
| description | A system and method for reflowing solder to interconnect a plurality of electronic components (
24
) to a substrate (
12
) is disclosed. The system includes an oven for preheating the substrate (
12
) and the plurality of electronic components (
24
) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (
72
), a pallet (
14
) for supporting the substrate (
12
), wherein the pallet (
14
) has at least one internal cavity (
40
), and a phase-transition material (
42
) disposed within the cavity (
40
) for absorbing heat from the pallet (
14
). |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20040094607</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20040094607</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200400946073</originalsourceid><addsrcrecordid>eNqVizEKAjEQANNYiPqHbS2EoIdiLYqNlfZHLrfRQLIbshvQ33uFH7CaYmbm5nb_iGIGRyNk1BePELhC5kYa6QmY0Gtlih4858KEpAJMyhASvuOQEKQNotUpytLMgkuCqx8XZn05P07XTZMy-WntXSkpeqeRSfqttZ21x25vD7t_2i9KqT4e</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>System and method for mounting electronic components onto flexible substrates</title><source>USPTO Published Applications</source><creator>Schweitzer, Charles ; Goenka, Lakhi ; Bullock, Lawrence ; Miller, Mark ; Baker, Jay ; Chiles, Karen ; Achari, Achyuta ; Bullock, Jason ; Bullock, Shona</creator><creatorcontrib>Schweitzer, Charles ; Goenka, Lakhi ; Bullock, Lawrence ; Miller, Mark ; Baker, Jay ; Chiles, Karen ; Achari, Achyuta ; Bullock, Jason ; Bullock, Shona</creatorcontrib><description>A system and method for reflowing solder to interconnect a plurality of electronic components (
24
) to a substrate (
12
) is disclosed. The system includes an oven for preheating the substrate (
12
) and the plurality of electronic components (
24
) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (
72
), a pallet (
14
) for supporting the substrate (
12
), wherein the pallet (
14
) has at least one internal cavity (
40
), and a phase-transition material (
42
) disposed within the cavity (
40
) for absorbing heat from the pallet (
14
).</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040094607$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10149031$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Schweitzer, Charles</creatorcontrib><creatorcontrib>Goenka, Lakhi</creatorcontrib><creatorcontrib>Bullock, Lawrence</creatorcontrib><creatorcontrib>Miller, Mark</creatorcontrib><creatorcontrib>Baker, Jay</creatorcontrib><creatorcontrib>Chiles, Karen</creatorcontrib><creatorcontrib>Achari, Achyuta</creatorcontrib><creatorcontrib>Bullock, Jason</creatorcontrib><creatorcontrib>Bullock, Shona</creatorcontrib><title>System and method for mounting electronic components onto flexible substrates</title><description>A system and method for reflowing solder to interconnect a plurality of electronic components (
24
) to a substrate (
12
) is disclosed. The system includes an oven for preheating the substrate (
12
) and the plurality of electronic components (
24
) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (
72
), a pallet (
14
) for supporting the substrate (
12
), wherein the pallet (
14
) has at least one internal cavity (
40
), and a phase-transition material (
42
) disposed within the cavity (
40
) for absorbing heat from the pallet (
14
).</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNqVizEKAjEQANNYiPqHbS2EoIdiLYqNlfZHLrfRQLIbshvQ33uFH7CaYmbm5nb_iGIGRyNk1BePELhC5kYa6QmY0Gtlih4858KEpAJMyhASvuOQEKQNotUpytLMgkuCqx8XZn05P07XTZMy-WntXSkpeqeRSfqttZ21x25vD7t_2i9KqT4e</recordid><startdate>20040520</startdate><enddate>20040520</enddate><creator>Schweitzer, Charles</creator><creator>Goenka, Lakhi</creator><creator>Bullock, Lawrence</creator><creator>Miller, Mark</creator><creator>Baker, Jay</creator><creator>Chiles, Karen</creator><creator>Achari, Achyuta</creator><creator>Bullock, Jason</creator><creator>Bullock, Shona</creator><scope>EFI</scope></search><sort><creationdate>20040520</creationdate><title>System and method for mounting electronic components onto flexible substrates</title><author>Schweitzer, Charles ; Goenka, Lakhi ; Bullock, Lawrence ; Miller, Mark ; Baker, Jay ; Chiles, Karen ; Achari, Achyuta ; Bullock, Jason ; Bullock, Shona</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200400946073</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Schweitzer, Charles</creatorcontrib><creatorcontrib>Goenka, Lakhi</creatorcontrib><creatorcontrib>Bullock, Lawrence</creatorcontrib><creatorcontrib>Miller, Mark</creatorcontrib><creatorcontrib>Baker, Jay</creatorcontrib><creatorcontrib>Chiles, Karen</creatorcontrib><creatorcontrib>Achari, Achyuta</creatorcontrib><creatorcontrib>Bullock, Jason</creatorcontrib><creatorcontrib>Bullock, Shona</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schweitzer, Charles</au><au>Goenka, Lakhi</au><au>Bullock, Lawrence</au><au>Miller, Mark</au><au>Baker, Jay</au><au>Chiles, Karen</au><au>Achari, Achyuta</au><au>Bullock, Jason</au><au>Bullock, Shona</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System and method for mounting electronic components onto flexible substrates</title><date>2004-05-20</date><risdate>2004</risdate><abstract>A system and method for reflowing solder to interconnect a plurality of electronic components (
24
) to a substrate (
12
) is disclosed. The system includes an oven for preheating the substrate (
12
) and the plurality of electronic components (
24
) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (
72
), a pallet (
14
) for supporting the substrate (
12
), wherein the pallet (
14
) has at least one internal cavity (
40
), and a phase-transition material (
42
) disposed within the cavity (
40
) for absorbing heat from the pallet (
14
).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_uspatents_applications_20040094607 |
| source | USPTO Published Applications |
| title | System and method for mounting electronic components onto flexible substrates |
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