System and method for mounting electronic components onto flexible substrates
A system and method for reflowing solder to interconnect a plurality of electronic components ( 24 ) to a substrate ( 12 ) is disclosed. The system includes an oven for preheating the substrate ( 12 ) and the plurality of electronic components ( 24 ) disposed thereon, a supplemental heat source disp...
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| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | A system and method for reflowing solder to interconnect a plurality of electronic components (
24
) to a substrate (
12
) is disclosed. The system includes an oven for preheating the substrate (
12
) and the plurality of electronic components (
24
) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (
72
), a pallet (
14
) for supporting the substrate (
12
), wherein the pallet (
14
) has at least one internal cavity (
40
), and a phase-transition material (
42
) disposed within the cavity (
40
) for absorbing heat from the pallet (
14
). |
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