Method for the production of an electronic component

The production method for electronic packages with a circuit arrangement applied to a support body and with vias in the support body shall be simplified and improved. For this, the vias in the support body are closed with a highly viscous screen printing material following the application of a first metallizing layer forming the base metallization on the support body and in the lead-throughs provided for the formation of the vias. A low viscosity passivating layer which has been applied on the entire surface of the top side and bottom side of the support body is selectively removed from certain areas of the top side of the support body. A second metallizing layer forming the final metallization is applied to the first metallization layer in the areas from which the passivating layer has been removed. The second metallization layer is a material having a low melting point. The electronic components of the circuit arrangement on the top side of the support body are applied and contacted by a soldering process. Method for closing of electric and thermal vias in printed circuit boards of electronic packages.