Methods of manufacturing a printed circuit board shielded against interfering radiation
Methods for the production of a board ( 11 ) with printed circuit ( 12 ) shielded against interfering radiation and having electronic components ( 14 ) comprise the steps of positioning of the electronic components ( 14 ) on contact points ( 15 ) designed for them, and the application of a shield (...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Methods for the production of a board (
11
) with printed circuit (
12
) shielded against interfering radiation and having electronic components (
14
) comprise the steps of positioning of the electronic components (
14
) on contact points (
15
) designed for them, and the application of a shield (
20
), comprising a preformed metallized plastic film (
30
) over the top of the electronic components (
14
) and in electrical contact with the earth (
13
) on the board (
11
) with printed circuit (
12
), and also fixing the electronic components (
14
) on the board (
11
) with printed circuit (
12
) by means of an electrically conducting fixing agent (
16
); and fixing of the shield (
20
) on the board (
11
) with printed circuit (
12
). |
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