High frequency composite component
Disclosed is a high frequency composite component formed of a single module comprising a surface acoustic wave (SAW) duplexer and a diplexer in a front-end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band m...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Lee, Chang Yong Shin, Yu Seon Lee, Jong Ik |
| description | Disclosed is a high frequency composite component formed of a single module comprising a surface acoustic wave (SAW) duplexer and a diplexer in a front-end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal, thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal. The diplexer is formed of a conductive pattern on a plurality of dielectric sheets of a laminated structure, and the SAW duplexer includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure. |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20030220083</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20030220083</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200302200833</originalsourceid><addsrcrecordid>eNrjZFDyyEzPUEgrSi0sTc1LrlRIzs8tyC_OLEmFsPJS80p4GFjTEnOKU3mhNDeDpptriLOHbmlxQWIJUEFxfGJBQU5mcmJJZn5ecbyRgYGxgRGQtDA2JkUtANWlLVk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High frequency composite component</title><source>USPTO Published Applications</source><creator>Lee, Chang Yong ; Shin, Yu Seon ; Lee, Jong Ik</creator><creatorcontrib>Lee, Chang Yong ; Shin, Yu Seon ; Lee, Jong Ik</creatorcontrib><description>Disclosed is a high frequency composite component formed of a single module comprising a surface acoustic wave (SAW) duplexer and a diplexer in a front-end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal, thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal. The diplexer is formed of a conductive pattern on a plurality of dielectric sheets of a laminated structure, and the SAW duplexer includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20030220083$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10419774$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee, Chang Yong</creatorcontrib><creatorcontrib>Shin, Yu Seon</creatorcontrib><creatorcontrib>Lee, Jong Ik</creatorcontrib><title>High frequency composite component</title><description>Disclosed is a high frequency composite component formed of a single module comprising a surface acoustic wave (SAW) duplexer and a diplexer in a front-end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal, thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal. The diplexer is formed of a conductive pattern on a plurality of dielectric sheets of a laminated structure, and the SAW duplexer includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZFDyyEzPUEgrSi0sTc1LrlRIzs8tyC_OLEmFsPJS80p4GFjTEnOKU3mhNDeDpptriLOHbmlxQWIJUEFxfGJBQU5mcmJJZn5ecbyRgYGxgRGQtDA2JkUtANWlLVk</recordid><startdate>20031127</startdate><enddate>20031127</enddate><creator>Lee, Chang Yong</creator><creator>Shin, Yu Seon</creator><creator>Lee, Jong Ik</creator><scope>EFI</scope></search><sort><creationdate>20031127</creationdate><title>High frequency composite component</title><author>Lee, Chang Yong ; Shin, Yu Seon ; Lee, Jong Ik</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200302200833</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Lee, Chang Yong</creatorcontrib><creatorcontrib>Shin, Yu Seon</creatorcontrib><creatorcontrib>Lee, Jong Ik</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee, Chang Yong</au><au>Shin, Yu Seon</au><au>Lee, Jong Ik</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High frequency composite component</title><date>2003-11-27</date><risdate>2003</risdate><abstract>Disclosed is a high frequency composite component formed of a single module comprising a surface acoustic wave (SAW) duplexer and a diplexer in a front-end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal, thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal. The diplexer is formed of a conductive pattern on a plurality of dielectric sheets of a laminated structure, and the SAW duplexer includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_uspatents_applications_20030220083 |
| source | USPTO Published Applications |
| title | High frequency composite component |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T22%3A53%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFI&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Lee,%20Chang%20Yong&rft.date=2003-11-27&rft_id=info:doi/&rft_dat=%3Cuspatents_EFI%3E20030220083%3C/uspatents_EFI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |