High frequency composite component

Disclosed is a high frequency composite component formed of a single module comprising a surface acoustic wave (SAW) duplexer and a diplexer in a front-end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal, thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal. The diplexer is formed of a conductive pattern on a plurality of dielectric sheets of a laminated structure, and the SAW duplexer includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure.