Hardener for an epoxy resin compound, method for curing an epoxy resin compound, epoxy resin compound, and utilizations thereof
A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt. The tetraalkylphosphonium salt has the following formula: P(R′, R″, R′″, R″″) 4 + , X − , where R′, R″, R′″, R″″ are individually-selected alkyls ranging from C 2 to C 20 , X − is an anion such as Hal − , ClO...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt. The tetraalkylphosphonium salt has the following formula:
P(R′, R″, R′″, R″″)
4
+
, X
−
, where
R′, R″, R′″, R″″ are individually-selected alkyls ranging from C
2
to C
20
,
X
−
is an anion such as Hal
−
, ClO
4
−
, RCO
2
(Ac
−
), MX′
6
−
; where M is P, As, Sb; and X
−
is Hal
−
.
The hardener, an application thereof in the fabrication of an epoxy resin, the epoxy resin itself, and a method for curing an epoxy resin compound, create a material system that is suitable for the field of optoelectronics. |
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