In-situ pre-clean for electroplating process

Embodiments of the invention generally provide a waveform to be applied to a seed layer prior to initiating plating operations, wherein the waveform is configured to remove organic contaminants from the seed layer. The application of the waveform generally includes applying a plurality of anodic pulses to the seed layer prior to an electrochemical deposition process and subsequent to the seed layer contacting a plating solution, and applying a cathodic pulse to the seed layer immediately following each of the plurality of anodic pulses. The waveform is generally provided by a power supply in electrical communication with a system controller configured to supply controlling signals to the power supply.