Flip-chip bonding method

The present invention is generally directed towards a flip chip assembly. In particular a new bonding process for bonding an electronic component to the substrate is disclosed. The method comprises the steps of forming at least one solder pad on the electronic component and forming at least one bond pad on the substrate wherein the at least one bond pad has a top layer formed of a metal. Placing an underfill film on top of the at least one bond pad and heating the electronic component and the substrate. Moving the electronic component towards the substrate such that the at least one solder pad is aligned on top of the at least one bond pad and finally forming a bond between the at least one solder pad and the top layer of the at least one bond pad.