Right-angle power interconnect electronic packaging assembly
The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board. |
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