Method of manufacturing semiconductor devices
A semiconductor device manufacturing method by which an organic resin film is formed on a semiconductor substrate in which integrated circuit elements and a wiring pattern have been formed and the entire circuit is sealed in a mold resin, includes a step of using an exposure mask having at least a p...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device manufacturing method by which an organic resin film is formed on a semiconductor substrate in which integrated circuit elements and a wiring pattern have been formed and the entire circuit is sealed in a mold resin, includes a step of using an exposure mask having at least a pattern finer than the resolution limit of the organic resin to form a plurality of cavities on the surface of the organic resin film. |
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